Part Number Hot Search : 
COLTD XC2VP100 CB07108 20001 08226 BTA225 LS7636FO T2222
Product Description
Full Text Search
 

To Download CY8CLED04-68LTXI Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 CY8CLED04
EZ-ColorTM HB LED Controller
Features
HB LED Controller Configurable Dimmers Support up to four Independent LED Channels 8 to 32 Bits of Resolution per Channel Dynamic Reconfiguration Enables LED Controller Plus Other Features: CapSense, Battery Charging, and Motor Control Visual Embedded Design LED-Based Drivers * Binning Compensation * Temperature Feedback * Optical Feedback * DMX512

PrISM Modulation Technology Reduces Radiated EMI Reduces Low Frequency Blinking (R) Advanced Peripherals (PSoC Blocks) Four Digital PSoC Blocks Provide: * 8 to 32-Bit Timers, Counters, and PWMs * Full-duplex UART * Multiple SPI Masters or Slaves * Connectable to all GPI/O pins Six Rail-to-Rail Analog Psoc Blocks Provide: * Up to 14-Bit ADCs * Up to 9-Bit DACs * Programmable Gain Amplifiers * Programmable Filters And Comparators Complex Peripherals By Combining Blocks Capacitive Sensing Application Capability
Complete Development Tools Free Development Software * PSoC DesignerTM Full Featured, In-Circuit Emulator and Programmer Full Speed Emulation Complex Breakpoint Structure 128 KBytes Trace Memory Programmable Pin Configurations 25 mA Sink, 10 mA Source on all GPI/O Pull Up, Pull Down, High Z, Strong, or Open Drain Drive Modes on all GPI/O Up to 12 Analog Inputs on GPI/O Four 30 mA Analog Outputs on GPI/O Configurable Interrupt on all GPI/O Flexible On-Chip Memory 16K Flash Program Storage 50,000 Erase/Write Cycles 1K SRAM Data Storage In-System Serial Programming (ISSP) Partial Flash Updates Flexible Protection Modes EEPROM Emulation in Flash Full Speed USB (12 Mbps) Four Uni-Directional Endpoints One Bi-Directional Control Endpoint USB 2.0 Compliant Dedicated 256 Byte Buffer No External Crystal Required
Cypress Semiconductor Corporation Document Number: 001-13108 Rev. *C
*
198 Champion Court
*
San Jose, CA 95134-1709 * 408-943-2600 Revised January 15, 2010
[+] Feedback
CY8CLED04
Logic Block Diagram
Port 7 Port 5 Port 4 Port 3 Port 2 Port 1 Port 0 Analog Drivers
System Bus
Global Digital Interconnect
Global Analog Interconnect
PSoC CORE
SRAM 1K Interrupt Controller SROM Flash 16K Sleep and Watchdog
CPU Core (M8C) Clock Sources (Includes IMO and ILO)
DIGITAL SYSTEM
Digital Block Array
ANALOG SYSTEM
Analog Ref.
Analog Block Array
Digital 2 Decimator Clocks MACs Type 2
I2C
Internal POR and LVD Voltage System Resets Ref.
USB
Analog Input Muxing
SYSTEM RESOURCES
Document Number: 001-13108 Rev. *C
Page 2 of 37
[+] Feedback
CY8CLED04
Contents
EZ-ColorTM Functional Overview....................................... 4 Target Applications........................................................ 4 The PSoC Core ............................................................. 4 The Digital System ........................................................ 4 The Analog System ....................................................... 5 The Analog Multiplexer System..................................... 6 Additional System Resources ....................................... 6 EZ-Color Device Characteristics ................................... 6 Getting Started.................................................................... 7 Application Notes .......................................................... 7 Development Kits .......................................................... 7 Training ......................................................................... 7 Cypros Consultants ....................................................... 7 Solutions Library............................................................ 7 Technical Support ......................................................... 7 Development Tools ............................................................ 7 PSoC Designer Software Subsystems.......................... 7 In-Circuit Emulator......................................................... 8 Document Conventions ..................................................... 8 Units of Measure ........................................................... 8 Numeric Naming............................................................ 8 Acronyms Used ............................................................. 8 Pin Information ................................................................... 9 68-Pin Part Pinout ......................................................... 9 Register Conventions ...................................................... 10 Abbreviations Used ..................................................... 10 Register Mapping Tables ............................................ 10 Electrical Specifications .................................................. 13 Absolute Maximum Ratings...........................................14 Operating Temperature ............................................... 14 DC Electrical Characteristics....................................... 15 AC Electrical Characteristics ....................................... 23 Packaging Information..................................................... 31 Thermal Impedance .................................................... 32 Solder Reflow Peak Temperature ............................... 32 Development Tools .......................................................... Software ...................................................................... Evaluation Tools.......................................................... Device Programmers................................................... Third Party Tools ......................................................... Build a PSoC Emulator into Your Board...................... Ordering Information........................................................ Key Device Features ................................................... Ordering Code Definitions ........................................... Document History Page ................................................... Sales, Solutions, and Legal Information ........................ Worldwide Sales and Design Support......................... Products ...................................................................... 33 33 33 34 34 34 35 35 35 36 37 37 37
Document Number: 001-13108 Rev. *C
Page 3 of 37
[+] Feedback
CY8CLED04
EZ-ColorTM Functional Overview
Cypress's EZ-Color family of devices offers the ideal control solution for high brightness LED applications requiring intelligent dimming control. EZ-Color devices combine the power and flexibility of PSoC (Programmable System-on-Chip); with Cypress's PrISM (precise illumination signal modulation) modulation technology providing lighting designers a fully customizable and integrated lighting solution platform. The EZ-Color family supports a range of independent LED channels from 4 channels at 32 bits of resolution each, up to 16 channels at 8 bits of resolution each. This enables lighting designers the flexibility to choose the LED array size and color quality. PSoC Designer software, with lighting specific drivers, can significantly cut development time and simplify implementation of fixed color points through temperature, optical, and LED binning compensation. EZ-Color's virtually limitless analog and digital customization enable simple integration of features in addition to intelligent lighting, such as CapSense, battery charging, image stabilization, and motor control during the development process. These features, along with Cypress's best-in-class quality and design support, make EZ-Color the ideal choice for intelligent HB LED control applications.
EZ-Color GPI/Os provide connection to the CPU, digital and analog resources of the device. Each pin's drive mode may be selected from eight options, allowing great flexibility in external interfacing. Every pin can also generate a system interrupt on high level, low level, and change from last read.
The Digital System
The Digital System is composed of four digital PSoC blocks. Each block is an 8-bit resource that can be used alone or combined with other blocks to form 8, 16, 24, and 32-bit peripherals, which are called user module references. Digital peripheral configurations include:

PrISM (8 to 32 bit) Full speed USB (12 Mbps) PWMs (8 to 32 bit) PWMs with Dead band (8 to 24 bit) Counters (8 to 32 bit) Timers (8 to 32 bit) UART 8-bit with selectable parity SPI master and slave I2C slave and multi-master Cyclical Redundancy Checker/Generator (8 to 32 bit) IrDA Generators (8 to 32 bit)
Target Applications

LCD Backlight Large Signs General Lighting Architectural Lighting Camera/Cell Phone Flash Flashlights
The PSoC Core
The PSoC Core is a powerful engine that supports a rich feature set. The core includes a CPU, memory, clocks, and configurable GPI/O (General Purpose I/O). The M8C CPU core is a powerful processor with speeds up to 68 MHz, providing a four MIPS 8-bit Harvard architecture microprocessor. The CPU uses an interrupt controller with up to 20 vectors, to simplify programming of real time embedded events. Program execution is timed and protected using the included Sleep and Watch Dog Timers (WDT). Memory encompasses 16K of Flash for program storage, 1K of SRAM for data storage, and up to 2K of EEPROM emulated using the Flash. Program Flash uses four protection levels on blocks of 64 bytes, allowing customized software IP protection. The EZ-Color family incorporates flexible internal clock generators, including a 24 MHz IMO (internal main oscillator) accurate to 8 percent over temperature and voltage. The 24 MHz IMO can also be doubled to 48 MHz for use by the digital system. A low power 32 kHz ILO (internal low speed oscillator) is provided for the Sleep timer and WDT. The clocks, together with programmable clock dividers (as a System Resource), provide the flexibility to integrate almost any timing requirement into the EZ-Color device. In USB systems, the IMO self-tunes to 0.25% accuracy for USB communication.
The digital blocks can be connected to any GPI/O through a series of global buses that can route any signal to any pin. The buses also allow for signal multiplexing and for performing logic operations. This configurability frees your designs from the constraints of a fixed peripheral controller. Digital blocks are provided in rows of four, where the number of blocks varies by EZ-Color device family. This allows you the optimum choice of system resources for your application. Family resources are shown in the table titled EZ-Color Device Characteristics. Figure 1. Digital System Block Diagram
Port 7 Port 5 Port 4 Port 3 Port 2 Port 1 Port 0
Digital Clocks From Core
To System Bus
To Analog System
DIGITAL SYSTEM
Digital PSoC Block Array
Row Input Configuration 8 8
Row 0
DBB00 DBB01 DCB02
4 DCB03 4
8 8
Row Output Configuration
GIE[7:0] GIO[7:0]
Global Digital Interconnect
GOE[7:0] GOO[7:0]
Document Number: 001-13108 Rev. *C
Page 4 of 37
[+] Feedback
CY8CLED04
The Analog System
The Analog System is composed of six configurable blocks, each comprised of an opamp circuit allowing the creation of complex analog signal flows. Analog peripherals are very flexible and can be customized to support specific application requirements. Some of the more common EZ-Color analog functions (most available as user modules) are listed below.

Figure 2. Analog System Block Diagram
All IO (Except Port 7) P0[7] P0[5] P0[3] P0[1] AGNDIn RefIn Analog Mux Bus P0[6] P0[4] P0[2] P0[0] P2[6]
Analog-to-digital converters (up to 2, with 6- to 14-bit resolution, selectable as Incremental, Delta Sigma, and SAR) Filters (2 and 4 pole band-pass, low-pass, and notch) Amplifiers (up to 2, with selectable gain to 48x) Instrumentation amplifiers (1 with selectable gain to 93x) Comparators (up to 2, with 16 selectable thresholds) DACs (up to 2, with 6- to 9-bit resolution) Multiplying DACs (up to 2, with 6- to 9-bit resolution) High current output drivers (two with 30 mA drive as a PSoC Core Resource) 1.3V reference (as a System Resource) DTMF Dialer Modulators Correlators Peak Detectors Many other topologies possible
P2[3]
P2[4] P2[2] P2[0]
P2[1]
ACI0[1:0]
ACI1[1:0]
Array Input Configuration
Analog blocks are arranged in a column of three, which includes one CT (Continuous Time) and two SC (Switched Capacitor) blocks, as shown in the figure below.
Block Array
ACB00 ASC10 ASD20
ACB01 ASD11 ASC21
Analog Reference
Interface to Digital System RefHi RefLo AGND Reference Generators AGNDIn RefIn Bandgap
M8C Interface (Address Bus, Data Bus, Etc.)
Document Number: 001-13108 Rev. *C
Page 5 of 37
[+] Feedback
CY8CLED04
The Analog Multiplexer System
The Analog Mux Bus can connect to every GPI/O pin in ports 0-5. Pins can be connected to the bus individually or in any combination. The bus also connects to the analog system for analysis with comparators and analog-to-digital converters. It can be split into two sections for simultaneous dual-channel processing. An additional 8:1 analog input multiplexer provides a second path to bring Port 0 pins to the analog array. Switch control logic enables selected pins to precharge continuously under hardware control. This enables capacitive measurement for applications such as touch sensing. Other multiplexer applications include:

Additional System Resources
System Resources, provide additional capability useful to complete systems. Additional resources include a multiplier, decimator, low voltage detection, and power on reset. Brief statements describing the merits of each resource follow.
Full-Speed USB (12 Mbps) with 5 configurable endpoints and 256 bytes of RAM. No external components required except two series resistors. Wider than commercial temperature USB operation (-10C to +85C). Digital clock dividers provide three customizable clock frequencies for use in applications. The clocks can be routed to both the digital and analog systems. Additional clocks can be generated using digital PSoC blocks as clock dividers. Two multiply accumulates (MACs) provide fast 8-bit multipliers with 32-bit accumulate, to assist in both general math as well as digital filters. Decimator provides a custom hardware filter for digital signal processing apps. including creation of Delta Sigma ADCs. The I2C module provides 100 and 400 kHz communication over two wires. Slave, master, multi-master are supported. Low Voltage Detection (LVD) interrupts signal the application of falling voltage levels, while the advanced POR (Power On Reset) circuit eliminates the need for a system supervisor. An internal 1.3V reference provides an absolute reference for the analog system, including ADCs and DACs. Versatile analog multiplexer system.
Track pad, finger sensing. Chip-wide mux that allows analog input from up to 48 I/O pins. Crosspoint connection between any I/O pin combinations.

When designing capacitive sensing applications, refer to the latest signal-to-noise signal level requirements Application Notes, which can be found under http://www.cypress.com > Documentation. In general, and unless otherwise noted in the relevant Application Notes, the minimum signal-to-noise ratio (SNR) for CapSense applications is 5:1.

EZ-Color Device Characteristics
Depending on your EZ-Color device characteristics, the digital and analog systems can have 16, 8, or 4 digital blocks and 12, 6, or 4 analog blocks. The following table lists the resources available for specific EZ-Color device groups. The device covered by this data sheet is shown in the highlighted row of the table Table 1. EZ-Color Device Characteristics PSoC Part Number CY8CLED02 CY8CLED04 CY8CLED08 CY8CLED16 CapSense No Yes No No
[+] Feedback
LED Channels
Analog Columns
Analog Outputs
Analog Inputs
Analog Blocks
Digital Blocks
Digital I/O
Digital Rows
SRAM Size
2 4 8 16
16 56 44 44
1 1 2 4
4 4 8 16
8 48 12 12
0 2 4 4
2 2 4 4
4 6 12 12
256 Bytes 1K 256 Bytes 2K
Document Number: 001-13108 Rev. *C
Flash Size 4K 16K 16K 32K
Page 6 of 37
CY8CLED04
Getting Started
The quickest way to understand PSoC silicon is to read this data sheet and then use the PSoC Designer Integrated Development Environment (IDE). This data sheet is an overview of the PSoC integrated circuit and presents specific pin, register, and electrical specifications. For in depth information, along with detailed programming details, see the PSoC(R) Programmable System-on-Chip Technical Reference Manual. For up-to-date ordering, packaging, and electrical specification information, see the latest PSoC device data sheets on the web at http://www.cypress.com/ez-color.
Development Tools
PSoC Designer is a Microsoft(R) Windows-based, integrated development environment for the Programmable System-on-Chip (PSoC) devices. The PSoC Designer IDE runs on Windows XP or Windows Vista. This system provides design database management by project, an integrated debugger with In-Circuit Emulator, in-system programming support, and built-in support for third-party assemblers and C compilers. PSoC Designer also supports C language compilers developed specifically for the devices in the PSoC family.
PSoC Designer Software Subsystems
System-Level View A drag-and-drop visual embedded system design environment based on PSoC Designer. In the system level view you create a model of your system inputs, outputs, and communication interfaces. You define when and how an output device changes state based upon any or all other system devices. Based upon the design, PSoC Designer automatically selects one or more PSoC Mixed-Signal Controllers that match your system requirements. PSoC Designer generates all embedded code, then compiles and links it into a programming file for a specific PSoC device. Chip-Level View The chip-level view is a more traditional Integrated Development Environment (IDE) based on PSoC Designer. Choose a base device to work with and then select different onboard analog and digital components called user modules that use the PSoC blocks. Examples of user modules are ADCs, DACs, Amplifiers, and Filters. Configure the user modules for your chosen application and connect them to each other and to the proper pins. Then generate your project. This prepopulates your project with APIs and libraries that you can use to program your application. The device editor also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic configuration allows for changing configurations at run time. Hybrid Designs You can begin in the system-level view, allow it to choose and configure your user modules, routing, and generate code, then switch to the chip-level view to gain complete control over on-chip resources. All views of the project share a common code editor, builder, and common debug, emulation, and programming tools.
Application Notes
Application notes are an excellent introduction to the wide variety of possible PSoC designs. They are located here: www.cypress.com/psoc. Select Application Notes under the Documentation tab.
Development Kits
PSoC Development Kits are available online from Cypress at www.cypress.com/shop and through a growing number of regional and global distributors, which include Arrow, Avnet, Digi-Key, Farnell, Future Electronics, and Newark.
Training
Free PSoC technical training (on demand, webinars, and workshops) is available online at www.cypress.com/training. The training covers a wide variety of topics and skill levels to assist you in your designs.
Cypros Consultants
Certified PSoC Consultants offer everything from technical assistance to completed PSoC designs. To contact or become a PSoC Consultant go to www.cypress.com/cypros.
Solutions Library
Visit our growing library of solution focused designs at www.cypress.com/solutions. Here you can find various application designs that include firmware and hardware design files that enable you to complete your designs quickly.
Technical Support
For assistance with technical issues, search KnowledgeBase articles and forums at www.cypress.com/support. If you cannot find an answer to your question, call technical support at 1-800-541-4736.
Document Number: 001-13108 Rev. *C
Page 7 of 37
[+] Feedback
CY8CLED04
Code Generation Tools PSoC Designer supports multiple third party C compilers and assemblers. The code generation tools work seamlessly within the PSoC Designer interface and have been tested with a full range of debugging tools. The choice is yours. Assemblers. The assemblers allow assembly code to merge seamlessly with C code. Link libraries automatically use absolute addressing or are compiled in relative mode, and linked with other software modules to get absolute addressing. C Language Compilers. C language compilers are available that support the PSoC family of devices. The products allow you to create complete C programs for the PSoC family devices. The optimizing C compilers provide all the features of C tailored to the PSoC architecture. They come complete with embedded libraries providing port and bus operations, standard keypad and display support, and extended math functionality. Debugger The PSoC Designer Debugger subsystem provides hardware in-circuit emulation, allowing you to test the program in a physical system while providing an internal view of the PSoC device. Debugger commands allow the designer to read and program and read and write data memory, read and write I/O registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The debugger also allows the designer to create a trace buffer of registers and memory locations of interest. Online Help System The online help system displays online, context-sensitive help for the user. Designed for procedural and quick reference, each functional subsystem has its own context-sensitive help. This system also provides tutorials and links to FAQs and an Online Support Forum to aid the designer in getting started.
Document Conventions
Units of Measure
A units of measure table is located in the Electrical Specifications section. Table 5 on page 13 lists all the abbreviations used to measure the PSoC devices.
Numeric Naming
Hexidecimal numbers are represented with all letters in uppercase with an appended lowercase `h' (for example, `14h' or `3Ah'). Hexidecimal numbers may also be represented by a `0x' prefix, the C coding convention. Binary numbers have an appended lowercase `b' (e.g., 01010100b' or `01000011b'). Numbers not indicated by an `h' or `b' are decimal.
Acronyms Used
The following table lists the acronyms that are used in this document. Acronym AC ADC API CPU CT DAC DC ECO EEPROM FSR GPI/O GUI HBM ICE ILO IMO I/O IPOR LSb LVD MSb PC PLL POR PPOR PSoC(R) PWM SC SRAM Description alternating current analog-to-digital converter application programming interface central processing unit continuous time digital-to-analog converter direct current external crystal oscillator electrically erasable programmable read-only memory full scale range general purpose I/O graphical user interface human body model in-circuit emulator internal low speed oscillator internal main oscillator input/output imprecise power on reset least-significant bit low voltage detect most-significant bit program counter phase-locked loop power on reset precision power on reset Programmable System-on-ChipTM pulse width modulator switched capacitor static random access memory Page 8 of 37
In-Circuit Emulator
A low cost, high functionality In-Circuit Emulator (ICE) is available for development support. This hardware has the capability to program single devices. The emulator consists of a base unit that connects to the PC by way of a USB port. The base unit is universal and operates with all PSoC devices. Emulation pods for each device family are available separately. The emulation pod takes the place of the PSoC device in the target board and performs full speed (24 MHz) operation.
Document Number: 001-13108 Rev. *C
[+] Feedback
CY8CLED04
Pin Information
68-Pin Part Pinout
This Section describes, lists, and illustrates the CY8CLED04 EZ-Color device pins and pinout configuration. The CY8CLED04 device is available in the following package. Every port pin (labeled with a "P") is capable of Digital I/O. However, Vss, Vdd, and XRES are not capable of Digital I/O. Table 2. 68-Pin Part Pinout (QFN)[1, 2] Type Pin Figure 3. 68-Pin Device Name Description
No. Digital Analog 1 I/O M 2 I/O M 3 I/O M 4 I/O M 5 6 7 Power 8 I/O M 9 I/O M 10 I/O M 11 I/O M 12 I/O M 13 I/O M 14 I/O M 15 I/O M 16 I/O M 17 I/O M 18 I/O M 19 I/O M 20 Power 21 USB 22 USB 23 Power 24 I/O 25 I/O 26 I/O 27 I/O 28 I/O P4[7] P4[5] P4[3] P4[1] NC NC Vss P3[7] P3[5] P3[3] P3[1] P5[7] P5[5] P5[3] P5[1] P1[7] P1[5] P1[3] P1[1] Vss D+ DVdd P7[7] P7[6] P7[5] P7[4] P7[3]
P2[1], M, AI P2[3], M, AI P2[5], M P2[7], M P0[1], M, AI P0[3], M, AIO P0[5], M, AIO P0[7], M, AI Vss Vdd P0[6], M, AI P0[4], M, AI P0[2], M, AI P0[0], M, AI P2[6], M, Ext. VREF P2[4], M, Ext. AGND P2[2], M, AI
I2C Serial Clock (SCL). I2C Serial Data (SDA). I2C Serial Clock (SCL) ISSP SCLK. Ground connection.
29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49
I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O
M M M M M M M M M M M M
P7[2] P7[1] P7[0] P1[0] P1[2] P1[4] P1[6] P5[0] P5[2] P5[4] P5[6] P3[0] P3[2] P3[4] P3[6] NC NC XRES
I2C Serial Data (SDA), ISSP SDATA. Optional External Clock Input (EXTCLK).
Type Pin No. Digital Analog 50 I/O M 51 I/O I,M 52 I/O I,M 53 I/O M 54 55 56 57 58 59 60 61 62 I/O M I/O I,M I/O I,M I/O I,M I/O I,M Power Power I/O I,M I/O I/O,M I/O I/O I/O I/O I/O I/O I/O,M I,M M M I,M I,M
Name P4[6] P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] P0[4] P0[6] Vdd Vss P0[7] P0[5] P0[3] P0[1] P2[7] P2[5] P2[3] P2[1]
Input I/O I/O I/O M M M
No connection. No connection. Active high pin reset with internal pull down.
63 64 65 66 67 68
P4[0] P4[2] P4[4]
LEGENDA = Analog, I = Input, O = Output, NC = No Connection, M = Analog Mux Input. Notes 1. These are the ISSP pins, which are not High Z at POR. 2. The center pad on the QFN package should be connected to ground (Vss) for best mechanical, thermal, and electrical performance. If not connected to ground, it should be electrically floated and not connected to any other signal.
Document Number: 001-13108 Rev. *C
M, P1[3] I2C SCL, M, P1[1] Vss D+ DVdd P7[7] P7[6] P7[5] P7[4] P7[3] P7[2] P7[1] P7[0] I2C SDA, M, P1[0] M, P1[2] M, P1[4]
18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34
Supply voltage.
M, P4[7] M, P4[5] M, P4[3] M, P4[1] NC NC Vss M, P3[7] M, P3[5] M, P3[3] M, P3[1] M, P5[7] M, P5[5] M, P5[3] M, P5[1] I2C SCL, M, P1[7] I2C SDA, M, P1[5]
68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52
No connection. No connection. Ground connection.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35
QFN
(Top View)
P2[0], M, AI P4[6], M P4[4], M P4[2], M P4[0], M XRES NC NC P3[6], M P3[4], M P3[2], M P3[0], M P5[6], M P5[4], M P5[2], M P5[0], M P1[6], M
Description Direct switched capacitor block input. Direct switched capacitor block input. External Analog Ground (AGND) input. External Voltage Reference (VREF) input. Analog column mux input. Analog column mux input and column output. Analog column mux input and column output. Analog column mux input. Supply voltage. Ground connection. Analog column mux input, integration input #1 Analog column mux input and column output, integration input #2. Analog column mux input and column output. Analog column mux input.
Direct switched capacitor block input. Direct switched capacitor block input.
Page 9 of 37
[+] Feedback
CY8CLED04
Register Conventions
This section lists the registers of the CY8CLED04 EZ-Color device.
Abbreviations Used
The register conventions specific to this section are listed in the following table. Convention R W L C # Description Read register or bit(s) Write register or bit(s) Logical register or bit(s) Clearable register or bit(s) Access is bit specific
Register Mapping Tables
The device has a total register address space of 512 bytes. The register space is referred to as I/O space and is divided into two banks. The XOI bit in the Flag register (CPU_F) determines which bank the user is currently in. When the XOI bit is set the user is in Bank 1. Note In the following register mapping tables, blank fields are Reserved and should not be accessed. Table 3. Register Map Bank 0 Table: User Space
Name PRT0DR PRT0IE PRT0GS PRT0DM2 PRT1DR PRT1IE PRT1GS PRT1DM2 PRT2DR PRT2IE PRT2GS PRT2DM2 PRT3DR PRT3IE PRT3GS PRT3DM2 PRT4DR PRT4IE PRT4GS PRT4DM2 PRT5DR PRT5IE PRT5GS PRT5DM2 Addr (0,Hex) 00 01 02 03 04 05 06 07 08 09 0A 0B 0C Access RW RW RW RW RW RW RW RW RW RW RW RW RW Name PMA0_DR PMA1_DR PMA2_DR PMA3_DR PMA4_DR PMA5_DR PMA6_DR PMA7_DR USB_SOF0 USB_SOF1 USB_CR0 USBI/O_CR 0 USBI/O_CR 1 Addr (0,Hex) 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5D 5E 5F 60 61 62 63 64 Access RW RW RW RW RW RW RW RW R R RW # RW Name ASC10CR0 ASC10CR1 ASC10CR2 ASC10CR3 ASD11CR0 ASD11CR1 ASD11CR2 ASD11CR3 Addr (0,Hex) 80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F ASD20CR0 90 ASD20CR1 91 ASD20CR2 92 ASD20CR3 93 ASC21CR0 94 ASC21CR1 95 ASC21CR2 96 ASC21CR3 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 # Access is bit specific. Access RW RW RW RW RW RW RW RW Name Addr (0,Hex) Access C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF E0 E1 E2 E3 E4
0D RW 0E RW EP1_CNT1 0F RW EP1_CNT 10 RW EP2_CNT1 11 RW EP2_CNT 12 RW EP3_CNT1 13 RW EP3_CNT 14 RW EP4_CNT1 15 RW EP4_CNT 16 RW EP0_CR 17 RW EP0_CNT 18 EP0_DR0 19 EP0_DR1 1A EP0_DR2 1B EP0_DR3 PRT7DR 1C RW EP0_DR4 PRT7IE 1D RW EP0_DR5 PRT7GS 1E RW EP0_DR6 PRT7DM2 1F RW EP0_DR7 DBB00DR0 20 # AMX_IN DBB00DR1 21 W AMUXCFG DBB00DR2 22 RW DBB00CR0 23 # ARF_CR DBB01DR0 24 # CMP_CR0 Blank fields are Reserved and should not be accessed.
# RW # RW # RW # RW # # RW RW RW RW RW RW RW RW RW RW RW #
RW RW RW RW RW RW RW RW
CUR_PP STK_PP IDX_PP MVR_PP MVW_PP I2C_CFG I2C_SCR I2C_DR I2C_MSCR INT_CLR0 INT_CLR1 INT_CLR2 INT_CLR3 INT_MSK3 INT_MSK2 INT_MSK0 INT_MSK1 INT_VC RES_WDT DEC_DH
RW RW RW RW RW RW # RW # RW RW RW RW RW RW RW RW RC W RC
Document Number: 001-13108 Rev. *C
Page 10 of 37
[+] Feedback
CY8CLED04
Table 3. Register Map Bank 0 Table: User Space (continued)
Name DBB01DR1 DBB01DR2 DBB01CR0 DCB02DR0 DCB02DR1 DCB02DR2 DCB02CR0 DCB03DR0 DCB03DR1 DCB03DR2 DCB03CR0 Addr (0,Hex) 25 26 27 28 29 2A 2B 2C 2D 2E 2F 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F Blank fields are Reserved and should not be accessed. Access W RW # # W RW # # W RW # Name ASY_CR CMP_CR1 Addr (0,Hex) 65 66 67 68 69 6A 6B 6C 6D 6E 6F 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F Access # RW Name Addr (0,Hex) A5 A6 A7 A8 A9 AA AB AC AD AE AF B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF # Access is bit specific. Access Name DEC_DL DEC_CR0 DEC_CR1 MUL0_X MUL0_Y MUL0_DH MUL0_DL ACC0_DR 1 ACC0_DR 0 ACC0_DR 3 ACC0_DR 2 Addr (0,Hex) E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF Access RC RW RW W W R R RW RW RW RW
TMP_DR0 TMP_DR1 TMP_DR2 TMP_DR3 ACB00CR3 ACB00CR0 ACB00CR1 ACB00CR2 ACB01CR3 ACB01CR0 ACB01CR1 ACB01CR2
RW RW RW RW RW RW RW RW RW RW RW RW
MUL1_X MUL1_Y MUL1_DH MUL1_DL ACC1_DR1 ACC1_DR0 ACC1_DR3 ACC1_DR2 RDI0RI RDI0SYN RDI0IS RDI0LT0 RDI0LT1 RDI0RO0 RDI0RO1
W W R R RW RW RW RW RW RW RW RW RW RW RW
CPU_F
RL
DAC_D CPU_SCR 1 CPU_SCR 0
RW # #
Table 4. Register Map Bank 1 Table: Configuration Space
Name PRT0DM0 PRT0DM1 PRT0IC0 PRT0IC1 PRT1DM0 PRT1DM1 PRT1IC0 PRT1IC1 PRT2DM0 PRT2DM1 PRT2IC0 PRT2IC1 PRT3DM0 PRT3DM1 PRT3IC0 PRT3IC1 PRT4DM0 PRT4DM1 PRT4IC0 PRT4IC1 Addr (1,Hex) 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 10 11 12 13 Access RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW Name PMA0_WA PMA1_WA PMA2_WA PMA3_WA PMA4_WA PMA5_WA PMA6_WA PMA7_WA Addr (1,Hex) 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50 51 52 53 Access RW RW RW RW RW RW RW RW Name ASC10CR 0 ASC10CR 1 ASC10CR 2 ASC10CR 3 ASD11CR 0 ASD11CR 1 ASD11CR 2 ASD11CR 3 Addr (1,Hex) Access 80 RW 81 82 83 84 85 86 87 RW RW RW RW RW RW RW EP1_CR0 EP2_CR0 EP3_CR0 EP4_CR0 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 # # # # Name USBI/O_CR2 USB_CR1 Addr (1,Hex) Access C0 RW C1 #
PMA0_RA PMA1_RA PMA2_RA PMA3_RA
RW RW RW RW
88 89 8A 8B 8C 8D 8E 8F 90 ASD20CR 91 1 ASD20CR 92 2 ASD20CR 93 3
# Access is bit specific.
RW RW RW
GDI_O_IN GDI_E_IN GDI_O_OU GDI_E_OU
RW RW RW RW
Blank fields are Reserved and should not be accessed.
Document Number: 001-13108 Rev. *C
Page 11 of 37
[+] Feedback
CY8CLED04
Table 4. Register Map Bank 1 Table: Configuration Space (continued)
Name PRT5DM0 PRT5DM1 PRT5IC0 PRT5IC1 Addr (1,Hex) 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F Access RW RW RW RW Name PMA4_RA PMA5_RA PMA6_RA PMA7_RA Addr (1,Hex) 54 55 56 57 58 59 5A 5B 5C 5D 5E 5F 60 61 62 63 64 65 66 67 68 69 6A 6B 6C 6D 6E 6F 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F Access RW RW RW RW Name ASC21CR 0 ASC21CR 1 ASC21CR 2 ASC21CR 3 Addr (1,Hex) Access 94 RW 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF RW RW RW MUX_CR0 MUX_CR1 MUX_CR2 MUX_CR3 Name Addr (1,Hex) D4 D5 D6 D7 D8 D9 DA DB DC OSC_GO_EN DD OSC_CR4 DE OSC_CR3 DF OSC_CR0 E0 OSC_CR1 E1 OSC_CR2 E2 VLT_CR E3 VLT_CMP E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF RW RW RW RW RW RW RW RW RW RW RW R Access
PRT7DM0 PRT7DM1 PRT7IC0 PRT7IC1 DBB00FN DBB00IN DBB00OU DBB01FN DBB01IN DBB01OU DCB02FN DCB02IN DCB02OU DCB03FN DCB03IN DCB03OU
RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW
CLK_CR0 CLK_CR1 ABF_CR0 AMD_CR0 CMP_GO_E N CMP_GO_E N1 AMD_CR1 ALT_CR0
RW RW RW RW RW RW RW RW
TMP_DR0 TMP_DR1 TMP_DR2 TMP_DR3 ACB00CR3 ACB00CR0 ACB00CR1 ACB00CR2 ACB01CR3 ACB01CR0 ACB01CR1 ACB01CR2
RW RW RW RW RW RW RW RW RW RW RW RW
IMO_TR ILO_TR BDG_TR ECO_TR MUX_CR4 MUX_CR5
W W RW W RW RW
RDI0RI RDI0SYN RDI0IS RDI0LT0 RDI0LT1 RDI0RO0 RDI0RO1
RW RW RW RW RW RW RW CPU_F
RL
DAC_CR CPU_SCR1 CPU_SCR0
RW # #
Blank fields are Reserved and should not be accessed.
# Access is bit specific.
Document Number: 001-13108 Rev. *C
Page 12 of 37
[+] Feedback
CY8CLED04
Electrical Specifications
This section presents the DC and AC electrical specifications of the CY8CLED04 EZ-Color device. For the most up to date electrical specifications, confirm that you have the most recent data sheet by going to the web at http://www.cypress.com/ez-color. Specifications are valid for -40oC TA 85oC and TJ 100oC, except where noted. Specifications for devices running at greater than 12 MHz are valid for -40oC TA 70oC and TJ 82oC. Figure 4. Voltage versus CPU Frequency
5.25
4.75 Vdd Voltage
lid ng Va rati n e io Op Reg
3.00
93 kHz CPU Frequency
12 MHz
24 MHz
The following table lists the units of measure that are used in this chapter. Table 5. Units of Measure Symbol oC dB fF Hz KB Kbit kHz k MHz M A F H s V Vrms Unit of Measure degree Celsius decibels femto farad hertz 1024 bytes 1024 bits kilohertz kilohm megahertz megaohm microampere microfarad microhenry microsecond microvolts microvolts root-mean-square Symbol W mA ms mV nA ns nV W pA pF pp ppm ps sps s V Unit of Measure microwatts milli-ampere milli-second milli-volts nanoampere nanosecond nanovolts ohm picoampere picofarad peak-to-peak parts per million picosecond samples per second sigma: one standard deviation volts
Document Number: 001-13108 Rev. *C
Page 13 of 37
[+] Feedback
CY8CLED04
Absolute Maximum Ratings
Symbol TSTG Description Storage Temperature Min -55 Typ 25 Max +100 Units o C Notes Higher storage temperatures will reduce data retention time. Recommended storage temperature is +25oC 25oC. Extended duration storage temperatures above 65oC will degrade reliability.
TA Vdd VI/O VI/O2 IMI/O IMAI/O ESD LU
Ambient Temperature with Power Applied Supply Voltage on Vdd Relative to Vss DC Input Voltage DC Voltage Applied to Tri-state Maximum Current into any Port Pin Maximum Current into any Port Pin Configured as Analog Driver Electro Static Discharge Voltage Latch-up Current
-40 -0.5 Vss 0.5 Vss 0.5 -25 -50 2000 -
- - - - - - - -
+85 +6.0 Vdd + 0.5 Vdd + 0.5 +50 +50 - 200
o
C V V V
mA mA V mA Human Body Model ESD.
Operating Temperature
Symbol TA TAUSB TJ Description Ambient Temperature Ambient Temperature using USB Junction Temperature Min -40 -10 -40 Typ - - - Max +85 +85 +100 Units oC oC oC Notes
The temperature rise from ambient to junction is package specific. See "Thermal Impedance" on page 32. The user must limit the power consumption to comply with this requirement.
Document Number: 001-13108 Rev. *C
Page 14 of 37
[+] Feedback
CY8CLED04
DC Electrical Characteristics
DC Chip-Level Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Symbol Description Vdd Supply Voltage IDD5 Supply Current, IMO = 24 MHz (5V) Min 3.0 - Typ - 14 Max 5.25 27 Units V mA Notes See DC POR and LVD specifications, Table 16 on page 21. Conditions are Vdd = 5.0V, TA = 25 o C, CPU = 3 MHz, SYSCLK doubler disabled, VC1 = 1.5 MHz, VC2 = 93.75 kHz, VC3 = 93.75 kHz, analog power = off. Conditions are Vdd = 3.3V, TA = 25 oC, CPU = 3 MHz, SYSCLK doubler disabled, VC1 = 1.5 MHz, VC2 = 93.75 kHz, VC3 = 0.367 kHz, analog power = off. Conditions are with internal slow speed oscillator, Vdd = 3.3V, -40 oC TA 55 oC, analog power = off. Conditions are with internal slow speed oscillator, Vdd = 3.3V, 55 oC < TA 85 oC, analog power = off.
IDD3
Supply Current, IMO = 24 MHz (3.3V)
-
8
14
mA
ISB ISBH
Sleep (Mode) Current with POR, LVD, Sleep Timer, and WDT[3] Sleep (Mode) Current with POR, LVD, Sleep Timer, and WDT at high temperature.[3]
-
3
6.5
A A
-
4
25
DC General Purpose I/O Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 6. DC GPI/O Specifications Symbol Description Pull-Up Resistor RPU RPD Pull-Down Resistor High Output Level VOH Min 4 4 Vdd 1.0 Typ 5.6 5.6 - Max 8 8 - Units k k V Notes
VOL
Low Output Level
-
-
0.75
V
IOH
High Level Source Current
10
-
-
mA
IOL VIL VIH
Low Level Sink Current Input Low Level Input High Level
25 - 2.1
- - -
- 0.8
mA V V
I/OH = 10 mA, Vdd = 4.75 to 5.25V (8 total loads, 4 on even port pins (for example, P0[2], P1[4]), 4 on odd port pins (for example, P0[3], P1[5])). 80 mA maximum combined I/OH budget. I/OL = 25 mA, Vdd = 4.75 to 5.25V (8 total loads, 4 on even port pins (for example, P0[2], P1[4]), 4 on odd port pins (for example, P0[3], P1[5])). 200 mA maximum combined I/OL budget. VOH = Vdd-1.0V. See the limitations of the total current in the Note for VOH. VOL = 0.75V. See the limitations of the total current in the Note for VOL. Vdd = 3.0 to 5.25. Vdd = 3.0 to 5.25.
Note 3. Standby current includes all functions (POR, LVD, WDT, Sleep Time) needed for reliable system operation. This should be compared with devices that have similar functions enabled.
Document Number: 001-13108 Rev. *C
Page 15 of 37
[+] Feedback
CY8CLED04
Table 6. DC GPI/O Specifications (continued) VH IIL CIN COUT Input Hysterisis Input Leakage (Absolute Value) Capacitive Load on Pins as Input Capacitive Load on Pins as Output - - - - 60 1 3.5 3.5 - - 10 10 mV nA pF pF Gross tested to 1 A. Package and pin dependent. Temp = 25oC. Package and pin dependent. Temp = 25oC.
DC Full-Speed USB Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -10C TA 85C, or 3.0V to 3.6V and -10C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 7. DC Full-Speed (12 Mbps) USB Specifications Symbol Description USB Interface Differential Input Sensitivity VDI VCM Differential Input Common Mode Range Single Ended Receiver Threshold VSE Transceiver Capacitance CIN II/O High-Z State Data Line Leakage REXT External USB Series Resistor Static Output High, Driven VUOH VUOHI VUOL ZO VCRS Static Output High, Idle Static Output Low USB Driver Output Impedance D+/D- Crossover Voltage Min 0.2 0.8 0.8 - -10 23 2.8 2.7 - 28 1.3 Typ - - - - - - - - - - - Max - 2.5 2.0 20 10 25 3.6 3.6 0.3 44 2.0 Units V V V pF A W V V V W V | (D+) - (D-) | Notes
0V < VIN < 3.3V. In series with each USB pin. 15 k 5% to Ground. Internal pull-up enabled. 15 k 5% to Ground. Internal pull-up enabled. 15 k 5% to Ground. Internal pull-up enabled. Including REXT Resistor.
DC Operational Amplifier Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. The Operational Amplifier is a component of both the Analog Continuous Time PSoC blocks and the Analog Switched Capacitor PSoC blocks. The guaranteed specifications are measured in the Analog Continuous Time PSoC block. Table 8. 5V DC Operational Amplifier Specifications Description Input Offset Voltage (absolute value) Power = Low, Opamp Bias = High Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High TCVOSOA Average Input Offset Voltage Drift Input Leakage Current (Port 0 Analog IEBOA Pins) CINOA Input Capacitance (Port 0 Analog Pins) Symbol VOSOA Min - - - - - - Typ 1.6 1.3 1.2 7.0 20 4.5 Max 10 8 7.5 35.0 - 9.5 Units mV mV mV V/oC pA pF Notes
Gross tested to 1 A. Package and pin dependent. Temp = 25oC.
Document Number: 001-13108 Rev. *C
Page 16 of 37
[+] Feedback
CY8CLED04
Table 8. 5V DC Operational Amplifier Specifications (continued) Symbol VCMOA Description Common Mode Voltage Range Common Mode Voltage Range (high power or high opamp bias) Min 0.0 0.5 Typ - - Max Vdd Vdd - 0.5 Units V Notes The common-mode input voltage range is measured through an analog output buffer. The specification includes the limitations imposed by the characteristics of the analog output buffer.
Open Loop Gain Power = Low, Opamp Bias = High Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High VOHIGHO High Output Voltage Swing (internal signals) A Power = Low, Opamp Bias = High Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High VOLOWOA Low Output Voltage Swing (internal signals) Power = Low, Opamp Bias = High Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High ISOA Supply Current (including associated AGND buffer) Power = Low, Opamp Bias = Low Power = Low, Opamp Bias = High Power = Medium, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = Low Power = High, Opamp Bias = High PSRROA Supply Voltage Rejection Ratio
GOLOA
- 60 60 80
-
dB
Vdd - 0.2 Vdd - 0.2 Vdd - 0.5 - - -
- - - - - -
- - - 0.2 0.2 0.5
V V V V V V
- - - - - - 65
400 500 800 1200 2400 4600 80
800 900 1000 1600 3200 6400 -
A A A A A A dB
Vss VIN (Vdd - 2.25) or (Vdd 1.25V) VIN Vdd.
Table 9. 3.3V DC Operational Amplifier Specifications Symbol VOSOA Description Input Offset Voltage (absolute value) Power = Low, Opamp Bias = High Power = Medium, Opamp Bias = High High Power is 5 Volts Only Input Leakage Current (Port 0 Analog Pins) Input Capacitance (Port 0 Analog Pins) Common Mode Voltage Range Min - - - - - 0.2 Typ 1.65 1.32 7.0 20 4.5 - Max 10 8 35.0 - 9.5 Vdd - 0.2 Units mV mV V/oC pA pF V Gross tested to 1 A. Package and pin dependent. Temp = 25oC. The common-mode input voltage range is measured through an analog output buffer. The specification includes the limitations imposed by the characteristics of the analog output buffer. Notes
TCVOSOA Average Input Offset Voltage Drift IEBOA CINOA VCMOA
GOLOA
Open Loop Gain Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = Low Power = High, Opamp Bias = Low
- 60 60 80
-
dB
Document Number: 001-13108 Rev. *C
Page 17 of 37
[+] Feedback
CY8CLED04
Table 9. 3.3V DC Operational Amplifier Specifications (continued) Symbol VOHIGHO
A
Description High Output Voltage Swing (internal signals) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = Low Power = High is 5V only
Min Vdd - 0.2 Vdd - 0.2 Vdd - 0.2
Typ - - -
Max - - -
Units V V V
Notes
VOLOWOA Low Output Voltage Swing (internal signals) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = Low Power = High, Opamp Bias = Low ISOA Supply Current (including associated AGND buffer) Power = Low, Opamp Bias = Low Power = Low, Opamp Bias = High Power = Medium, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = Low Power = High, Opamp Bias = High Supply Voltage Rejection Ratio
- - -
- - -
0.2 0.2 0.2
V V V
- - - - - - 65
400 500 800 1200 2400 4600 80
800 900 1000 1600 3200 6400 -
A A A A A A dB Vss VIN (Vdd - 2.25) or (Vdd 1.25V) VIN Vdd.
PSRROA
DC Low Power Comparator Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, 3.0V to 3.6V and -40C TA 85C, or 2.4V to 3.0V and -40C TA 85C, respectively. Typical parameters apply to 5V at 25C and are for design guidance only. Table 10. DC Low Power Comparator Specifications Symbol VREFLPC ISLPC VOSLPC Description Low Power Comparator (LPC) Reference Voltage Range LPC Supply Current LPC Voltage Offset Min 0.2 - - Typ - 10 2.5 Max Vdd - 1 40 30 Units V A mV Notes
Document Number: 001-13108 Rev. *C
Page 18 of 37
[+] Feedback
CY8CLED04
DC Analog Output Buffer Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 11. 5V DC Analog Output Buffer Specifications Symbol VOSOB TCVOSOB VCMOB ROUTOB VOHIGHOB Description Input Offset Voltage (Absolute Value) Average Input Offset Voltage Drift Common-Mode Input Voltage Range Output Resistance Power = Low Power = High High Output Voltage Swing (Load = 32 ohms to Vdd/2) Power = Low Power = High Low Output Voltage Swing (Load = 32 ohms to Vdd/2) Power = Low Power = High Supply Current Including Bias Cell (No Load) Power = Low Power = High Supply Voltage Rejection Ratio Min - - 0.5 - - Typ 3 +6 - 0.6 0.6 - - Max 12 - Vdd - 1.0 - - - - Units mV V/C V W W V V Notes
0.5 x Vdd + 1.1 0.5 x Vdd + 1.1 - -
VOLOWOB
- -
0.5 x Vdd - 1.3 0.5 x Vdd - 1.3 5.1 8.8 -
V V
ISOB PSRROB
- - 53
1.1 2.6 64
mA mA dB
(0.5 x Vdd - 1.3) VOUT (Vdd - 2.3).
Table 12. 3.3V DC Analog Output Buffer Specifications Symbol VOSOB TCVOSOB VCMOB ROUTOB VOHIGHOB Description Input Offset Voltage (Absolute Value) Average Input Offset Voltage Drift Common-Mode Input Voltage Range Output Resistance Power = Low Power = High High Output Voltage Swing (Load = 1K ohms to Vdd/2) Power = Low Power = High Low Output Voltage Swing (Load = 1K ohms to Vdd/2) Power = Low Power = High Supply Current Including Bias Cell (No Load) Power = Low Power = High Supply Voltage Rejection Ratio Min - - 0.5 - - Typ 3 +6 1 1 - - Max 12 - Vdd - 1.0 - - - - Units mV V/C V W W V V Notes
0.5 x Vdd + 1.0 0.5 x Vdd + 1.0 - -
VOLOWOB
- -
0.5 x Vdd - 1.0 0.5 x Vdd - 1.0 2.0 4.3 -
V V
ISOB PSRROB
- 34
0.8 2.0 64
mA mA dB
(0.5 x Vdd - 1.0) VOUT (0.5 x Vdd + 0.9).
Document Number: 001-13108 Rev. *C
Page 19 of 37
[+] Feedback
CY8CLED04
DC Analog Reference Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. The guaranteed specifications are measured through the Analog Continuous Time PSoC blocks. The power levels for AGND refer to the power of the Analog Continuous Time PSoC block. The power levels for RefHi and RefLo refer to the Analog Reference Control register. The limits stated for AGND include the offset error of the AGND buffer local to the Analog Continuous Time PSoC block. Reference control power is high. Table 13. 5V DC Analog Reference Specifications
Symbol BG - - - - - - - - - - - - - - - - - Typ Max Units 1.30 1.32 V Vdd/2 - 0.01 Vdd/2 + 0.007 V 2 x BG - 0.030 2 x BG + 0.024 V P2[4] P2[4] + 0.011 V BG + 0.008 BG + 0.016 V 1.6 x BG - 0.010 1.6 x BG + 0.018 V 0.000 0.034 V Vdd/2 + BG Vdd/2 + BG + 0.10 V 3 x BG 3 x BG + 0.06 V 2 x BG + P2[6] 2 x BG + P2[6] + 0.077 V 0.018 RefHi = P2[4] + BandGap (P2[4] = Vdd/2) P2[4] + BG - 0.130 P2[4] + BG - 0.016 P2[4] + BG + 0.098 V RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6] = 1.3V) P2[4] + P2[6] - 0.133 P2[4] + P2[6] - 0.016 P2[4] + P2[6]+ 0.100 V RefHi = 3.2 x BandGap 3.2 x BG - 0.112 3.2 x BG 3.2 x BG + 0.076 V RefLo = Vdd/2 - BandGap Vdd/2 - BG - 0.04 Vdd/2 - BG + 0.024 Vdd/2 - BG + 0.04 V RefLo = BandGap BG - 0.06 BG BG + 0.06 V RefLo = 2 x BandGap - P2[6] (P2[6] = 1.3V) 2 x BG - P2[6] - 0.084 2 x BG - P2[6] + 2 x BG - P2[6] + 0.134 V 0.025 RefLo = P2[4] - BandGap (P2[4] = Vdd/2) P2[4] - BG - 0.056 P2[4] - BG + 0.026 P2[4] - BG + 0.107 V RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] = 1.3V) P2[4] - P2[6] - 0.057 P2[4] - P2[6] + 0.026 P2[4] - P2[6] + 0.110 V Description Min Bandgap Voltage Reference 1.28 AGND = Vdd/2[4] Vdd/2 - 0.04 AGND = 2 x BandGap[4] 2 x BG - 0.048 AGND = P2[4] (P2[4] = Vdd/2)[4] P2[4] - 0.011 AGND = BandGap[4] BG - 0.009 AGND = 1.6 x BandGap[4] 1.6 x BG - 0.022 AGND Block to Block Variation (AGND = Vdd/2)[4] -0.034 RefHi = Vdd/2 + BandGap Vdd/2 + BG - 0.10 RefHi = 3 x BandGap 3 x BG - 0.06 RefHi = 2 x BandGap + P2[6] (P2[6] = 1.3V) 2 x BG + P2[6] - 0.113
Table 14. 3.3V DC Analog Reference Specifications
Symbol BG - - - - - - - - - - - - - Description Bandgap Voltage Reference AGND = Vdd/2[5] AGND = 2 x BandGap[5] AGND = P2[4] (P2[4] = Vdd/2) AGND = BandGap[5] AGND = 1.6 x BandGap[5] AGND Column to Column Variation (AGND = Vdd/2)[5] RefHi = Vdd/2 + BandGap RefHi = 3 x BandGap RefHi = 2 x BandGap + P2[6] (P2[6] = 0.5V) RefHi = P2[4] + BandGap (P2[4] = Vdd/2) RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6] = 0.5V) RefHi = 3.2 x BandGap RefLo = Vdd/2 - BandGap Min 1.28 Vdd/2 - 0.03 P2[4] - 0.008 BG - 0.009 1.6 x BG - 0.027 -0.034 Typ 1.30 Vdd/2 - 0.01 Not Allowed P2[4] + 0.001 BG + 0.005 1.6 x BG - 0.010 0.000 Not Allowed Not Allowed Not Allowed Not Allowed P2[4] + P2[6] - 0.075 P2[4] + P2[6] - 0.009 P2[4] + P2[6] + 0.057 Not Allowed Not Allowed V Max 1.32 Vdd/2 + 0.005 P2[4] + 0.009 BG + 0.015 1.6 x BG + 0.018 0.034 Units V V V V V V
Notes 4. AGND tolerance includes the offsets of the local buffer in the PSoC block. Bandgap voltage is 1.3V 0.02V. 5. AGND tolerance includes the offsets of the local buffer in the PSoC block. Bandgap voltage is 1.3V 0.02V.
Document Number: 001-13108 Rev. *C
Page 20 of 37
[+] Feedback
CY8CLED04
Table 14. 3.3V DC Analog Reference Specifications (continued)
Symbol - - - - Description RefLo = BandGap RefLo = 2 x BandGap - P2[6] (P2[6] = 0.5V) RefLo = P2[4] - BandGap (P2[4] = Vdd/2) RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] = 0.5V) Min Typ Max Not Allowed Not Allowed Not Allowed P2[4]- P2[6] + 0.022 P2[4] - P2[6] + 0.092 Units
P2[4] - P2[6] - 0.048
V
DC Analog PSoC Block Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 15. DC Analog PSoC Block Specifications Symbol RCT CSC Description Resistor Unit Value (Continuous Time) Capacitor Unit Value (Switched Capacitor) Min - - Typ 12.2 80 Max - - Units k fF Notes
DC POR and LVD Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V or 3.3V at 25C and are for design guidance only. Note The bits PORLEV and VM in the table below refer to bits in the VLT_CR register. Table 16. DC POR and LVD Specifications Symbol VPPOR0R VPPOR1R VPPOR2R VPPOR0 VPPOR1 VPPOR2 VPH0 VPH1 VPH2 VLVD0 VLVD1 VLVD2 VLVD3 VLVD4 VLVD5 VLVD6 VLVD7 Description Vdd Value for PPOR Trip (positive ramp) PORLEV[1:0] = 00b PORLEV[1:0] = 01b PORLEV[1:0] = 10b Vdd Value for PPOR Trip (negative ramp) PORLEV[1:0] = 00b PORLEV[1:0] = 01b PORLEV[1:0] = 10b PPOR Hysteresis PORLEV[1:0] = 00b PORLEV[1:0] = 01b PORLEV[1:0] = 10b Vdd Value for LVD Trip VM[2:0] = 000b VM[2:0] = 001b VM[2:0] = 010b VM[2:0] = 011b VM[2:0] = 100b VM[2:0] = 101b VM[2:0] = 110b VM[2:0] = 111b Min Typ 2.91 4.39 4.55 2.82 4.39 4.55 92 0 0 2.92 3.02 3.13 4.00 4.48 4.64 4.73 4.81 Max Units V V V V V V mV mV mV V V V V V V V V V Notes
-
-
-
-
- - - 2.86 2.96 3.07 3.92 4.39 4.55 4.63 4.72
- - - 2.98[6] 3.08 3.20 4.08 4.57 4.74[7] 4.82 4.91
Notes 6. Always greater than 50 mV above PPOR (PORLEV = 00) for falling supply. 7. Always greater than 50 mV above PPOR (PORLEV = 10) for falling supply.
Document Number: 001-13108 Rev. *C
Page 21 of 37
[+] Feedback
CY8CLED04
DC Programming Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 17. DC Programming Specifications Description IDDP Supply Current During Programming or Verify VILP Input Low Voltage During Programming or Verify VIHP Input High Voltage During Programming or Verify IILP Input Current when Applying Vilp to P1[0] or P1[1] During Programming or Verify IIHP Input Current when Applying Vihp to P1[0] or P1[1] During Programming or Verify VOLV Output Low Voltage During Programming or Verify VOHV Output High Voltage During Programming or Verify FlashENP Flash Endurance (per block)
B
Symbol
Min - - 2.1 - - - Vdd - 1.0 50,000[8] 1,800,000 10
Typ 15 - - - - - - - - -
Max 30 0.8 - 0.2 1.5 Vss + 0.75 Vdd - - -
Units mA V V mA mA V V - - Years
Notes
Driving internal pull-down resistor. Driving internal pull-down resistor.
Erase/write cycles per block. Erase/write cycles.
FlashENT Flash Endurance (total)[9] FlashDR Flash Data Retention
Notes 8. The 50,000 cycle Flash endurance per block will only be guaranteed if the Flash is operating within one voltage range. Voltage ranges are 3.0V to 3.6V and 4.75V to 5.25V. 9. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks of 25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36x50,000 and that no single block ever sees more than 50,000 cycles). For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing. Refer to the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.
Document Number: 001-13108 Rev. *C
Page 22 of 37
[+] Feedback
CY8CLED04
AC Electrical Characteristics
AC Chip-Level Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 18. AC Chip-Level Specifications Description Internal Main Oscillator Frequency for 24 MHz (5V) FIMO243V Internal Main Oscillator Frequency for 24 MHz (3.3V) FIMOUSB5V Internal Main Oscillator Frequency with USB (5V) Frequency locking enabled and USB traffic present. FIMOUSB3V Internal Main Oscillator Frequency with USB (3.3V) Frequency locking enabled and USB traffic present. FCPU1 CPU Frequency (5V Nominal) FCPU2 CPU Frequency (3.3V Nominal) FBLK5 Digital PSoC Block Frequency (5V Nominal) FBLK3 F32K1 F32K_U Digital PSoC Block Frequency (3.3V Nominal) Internal Low Speed Oscillator Frequency Internal Low Speed Oscillator Untrimmed Frequency Symbol FIMO245V Min 23.04 22.08 23.94 Typ 24 24 24 Max 24.96[10,11] 25.92[11,12] 24.06[11] Units MHz MHz MHz Notes Trimmed for 5V operation using factory trim values. Trimmed for 3.3V operation using factory trim values. -10C TA 85C 4.35 Vdd 5.15 -0C TA 70C 3.15 Vdd 3.45
23.94
24
24.06[11]
MHz
0.093 0.093 0 0 15 5
24 12 48 24 32 -
24.96[10,11] 12.96[11,12] 49.92[10,11,13] 25.92[11,13] 64 -
MHz MHz MHz MHz kHz kHz
Refer to the AC Digital Block Specifications.
After a reset and before the m8c starts to run, the ILO is not trimmed. See the System Resets section of the PSoC Technical Reference Manual for details on timing this.
DCILO Jitter32k Step24M Fout48M
Internal Low Speed Oscillator Duty Cycle 32 kHz Period Jitter 24 MHz Trim Step Size 48 MHz Output Frequency
20 - - 46.08 - - - -
50 100 50 48.0 300 - - 16
80 - 49.92[10,12]
% ns kHz MHz ps MHz V/ms ms
Trimmed. Utilizing factory trim values.
Jitter24M1 24 MHz Period Jitter (IMO) Peak-to-Peak FMAX Maximum frequency of signal on row input or row output. SRPOWER_ Power Supply Slew Rate
UP
12.96 250 100
Vdd slew rate during power up. Power up from 0V. See the System Resets section of the PSoC Technical Reference Manual.
TPOWERUP Time from End of POR to CPU Executing Code
Notes 10. 4.75V < Vdd < 5.25V. 11. Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range. 12. 3.0V < Vdd < 3.6V. See Application Note AN2012 "Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation" for information on trimming for operation at 3.3V. 13. See the individual user module data sheets for information on maximum frequencies for user modules.
Document Number: 001-13108 Rev. *C
Page 23 of 37
[+] Feedback
CY8CLED04
Figure 5. 24 MHz Period Jitter (IMO) Timing Diagram
Jitter24M1
F24M
AC General Purpose I/O Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 19. AC GPI/O Specifications Symbol FGPI/O TRiseF TFallF TRiseS TFallS Description GPI/O Operating Frequency Rise Time, Normal Strong Mode, Cload = 50 pF Fall Time, Normal Strong Mode, Cload = 50 pF Rise Time, Slow Strong Mode, Cload = 50 pF Fall Time, Slow Strong Mode, Cload = 50 pF Min 0 3 2 10 10 Typ - - - 27 22 Max 12 18 18 - - Units MHz ns ns ns ns Notes Normal Strong Mode Vdd = 4.5 to 5.25V, 10% - 90% Vdd = 4.5 to 5.25V, 10% - 90% Vdd = 3 to 5.25V, 10% - 90% Vdd = 3 to 5.25V, 10% - 90%
Figure 6. GPI/O Timing Diagram
90% G PIO Pin O utput Voltage 10%
TR iseF TRiseS
TFallF TFallS
AC Full-Speed USB Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -10C TA 85C, or 3.0V to 3.6V and -10C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 20. AC Full-Speed (12 Mbps) USB Specifications Symbol TRFS TFSS TRFMFS TDRATEFS Description Transition Rise Time Transition Fall Time Rise/Fall Time Matching: (TR/TF) Full-Speed Data Rate Min 4 4 90 12 - 0.25% Typ - - - 12 Max 20 20 111 12 + 0.25% Units ns ns % Mbps Notes For 50 pF load. For 50 pF load. For 50 pF load.
Document Number: 001-13108 Rev. *C
Page 24 of 37
[+] Feedback
CY8CLED04
AC Operational Amplifier Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Settling times, slew rates, and gain bandwidth are based on the Analog Continuous Time PSoC block. Power = High and Opamp Bias = High is not supported at 3.3V. Table 21. 5V AC Operational Amplifier Specifications
Symbol TROA Description Rising Settling Time from 80% of V to 0.1% of V (10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High Falling Settling Time from 20% of V to 0.1% of V (10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High Gain Bandwidth Product Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High Noise at 1 kHz (Power = Medium, Opamp Bias = High) Min Typ Max Units s s s s s s V/s V/s V/s Notes
- - -
- - -
3.9 0.72 0.62
TSOA
- - - 0.15 1.7 6.5
- - - - - -
5.9 0.92 0.72 - - -
SRROA
SRFOA
0.01 0.5 4.0
- - -
- - -
V/s V/s V/s
BWOA
ENOA
0.75 3.1 5.4 -
- - - 100
- - - -
MHz MHz MHz nV/rt-Hz
Table 22. 3.3V AC Operational Amplifier Specifications Symbol TROA Description Rising Settling Time from 80% of V to 0.1% of V (10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Falling Settling Time from 20% of V to 0.1% of V (10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Gain Bandwidth Product Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Noise at 1 kHz (Power = Medium, Opamp Bias = High) Min Typ Max Units s s s s V/s V/s Notes
- -
- -
3.92 0.72
TSOA
- - 0.31 2.7
- - - -
5.41 0.72 - -
SRROA
SRFOA
0.24 1.8
- -
- -
V/s V/s
BWOA ENOA
0.67 2.8 -
- - 100
- - -
MHz MHz nV/rt-Hz
Document Number: 001-13108 Rev. *C
Page 25 of 37
[+] Feedback
CY8CLED04
When bypassed by a capacitor on P2[4], the noise of the analog ground signal distributed to each block is reduced by a factor of up to 5 (14 dB). This is at frequencies above the corner frequency defined by the on-chip 8.1k resistance and the external capacitor. Figure 7. Typical AGND Noise with P2[4] Bypass
dBV/rtHz 10000
0 0.01 0.1 1.0 10
1000
100 0.001
0.01
0.1 Freq (kHz)
1
10
100
At low frequencies, the opamp noise is proportional to 1/f, power independent, and determined by device geometry. At high frequencies, increased power level reduces the noise spectrum level. Figure 8. Typical Opamp Noise
nV/rtHz 10000 PH_BH PH_BL PM_BL PL_BL 1000
100
10 0.001
0.01
0.1
Freq (kHz)
1
10
100
Document Number: 001-13108 Rev. *C
Page 26 of 37
[+] Feedback
CY8CLED04
AC Low Power Comparator Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, 3.0V to 3.6V and -40C TA 85C, or 2.4V to 3.0V and -40C TA 85C, respectively. Typical parameters apply to 5V at 25C and are for design guidance only. Table 23. AC Low Power Comparator Specifications Symbol TRLPC Description LPC response time Min - Typ - Max 50 Units s Notes 50 mV overdrive comparator reference set within VREFLPC.
AC Digital Block Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 24. AC Digital Block Specifications Function Timer Description Capture Pulse Width Maximum Frequency, No Capture Maximum Frequency, With Capture Counter Enable Pulse Width Maximum Frequency, No Enable Input Maximum Frequency, Enable Input Dead Band Kill Pulse Width: Asynchronous Restart Mode Synchronous Restart Mode Disable Mode Maximum Frequency CRCPRS Maximum Input Clock Frequency (PRS Mode) CRCPRS Maximum Input Clock Frequency (CRC Mode) SPIM SPIS Maximum Input Clock Frequency Maximum Input Clock Frequency Width of SS_ Negated Between Transmissions Transmitter Receiver Maximum Input Clock Frequency Maximum Input Clock Frequency 20 50[14] 50[14] - - - - - - - - - - 49.92 49.92 ns ns ns MHz MHz 4.75V < Vdd < 5.25V. 4.75V < Vdd < 5.25V. Min 50[14] - - 50[14] - - Typ - - - - - - Max - 49.92 25.92 - 49.92 25.92 Units ns MHz MHz ns MHz MHz 4.75V < Vdd < 5.25V. 4.75V < Vdd < 5.25V. Notes
-
-
24.6
MHz
- - 50
[14]
- - - - -
8.2 4.1 - 24.6 24.6
MHz MHz ns MHz MHz
Maximum data rate at 4.1 MHz due to 2 x over clocking.
- -
Maximum data rate at 3.08 MHz due to 8 x over clocking. Maximum data rate at 3.08 MHz due to 8 x over clocking.
Note 14. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period).
Document Number: 001-13108 Rev. *C
Page 27 of 37
[+] Feedback
CY8CLED04
AC External Clock Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 25. AC External Clock Specifications Symbol FOSCEXT - - Duty Cycle Power up to IMO Switch Description Frequency for USB Applications Min 23.94 47 150 Typ 24 50 - Max 24.06 53 - Units MHz % s Notes
AC Analog Output Buffer Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 26. 5V AC Analog Output Buffer Specifications Symbol TROB TSOB SRROB SRFOB BWOBSS Description Rising Settling Time to 0.1%, 1V Step, 100pF Load Power = Low Power = High Falling Settling Time to 0.1%, 1V Step, 100pF Load Power = Low Power = High Rising Slew Rate (20% to 80%), 1V Step, 100pF Load Power = Low Power = High Falling Slew Rate (80% to 20%), 1V Step, 100pF Load Power = Low Power = High Small Signal Bandwidth, 20mVpp, 3dB BW, 100pF Load Power = Low Power = High Large Signal Bandwidth, 1Vpp, 3dB BW, 100pF Load Power = Low Power = High Min - - - - 0.65 0.65 0.65 0.65 0.8 0.8 Typ - - - - - - - - - - Max 2.5 2.5 2.2 2.2 - - - - - - Units s s s s V/s V/s V/s V/s MHz MHz Notes
BWOBLS
300 300
- -
- -
kHz kHz
Document Number: 001-13108 Rev. *C
Page 28 of 37
[+] Feedback
CY8CLED04
Table 27. 3.3V AC Analog Output Buffer Specifications Symbol TROB TSOB SRROB SRFOB BWOBSS BWOBLS Description Rising Settling Time to 0.1%, 1V Step, 100pF Load Power = Low Power = High Falling Settling Time to 0.1%, 1V Step, 100pF Load Power = Low Power = High Rising Slew Rate (20% to 80%), 1V Step, 100pF Load Power = Low Power = High Falling Slew Rate (80% to 20%), 1V Step, 100pF Load Power = Low Power = High Small Signal Bandwidth, 20mVpp, 3dB BW, 100pF Load Power = Low Power = High Large Signal Bandwidth, 1Vpp, 3dB BW, 100pF Load Power = Low Power = High Min - - - - 0.5 0.5 0.5 0.5 0.7 0.7 200 200 Typ - - - - - - - - - - - - Max 3.8 3.8 2.6 2.6 - - - - - - - - Units s s s s V/s V/s V/s V/s MHz MHz kHz kHz Notes
AC Programming Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 28. AC Programming Specifications Symbol TRSCLK TFSCLK TSSCLK THSCLK FSCLK TERASEB TWRITE TDSCLK TDSCLK3 TERASEAL
L
Description Rise Time of SCLK Fall Time of SCLK Data Set up Time to Falling Edge of SCLK Data Hold Time from Falling Edge of SCLK Frequency of SCLK Flash Erase Time (Block) Flash Block Write Time Data Out Delay from Falling Edge of SCLK Data Out Delay from Falling Edge of SCLK Flash Erase Time (Bulk)
Min 1 1 40 40 0 - - - - - - -
Typ - - - - - 10 40 - - 40 - -
Max 20 20 - - 8 - - 45 50 -
Units ns ns ns ns MHz ms ms ns ns ms
Notes
TPROGRA Flash Block Erase + Flash Block Write Time
M_HOT
100[15] ms 200[15] ms
Vdd > 3.6 3.0 Vdd 3.6 Erase all blocks and protection fields at once. 0C TJ 100C -40C TJ 0C
TPROGRA Flash Block Erase + Flash Block Write Time
M_COLD
Note 15. For the full industrial range, the user must employ a Temperature Sensor User Module (FlashTemp) and feed the result to the temperature argument before writing. Refer to the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.
Document Number: 001-13108 Rev. *C
Page 29 of 37
[+] Feedback
CY8CLED04
AC I2C Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 29. AC Characteristics of the I2C SDA and SCL Pins for Vdd Symbol FSCLI2C THDSTAI2
C
Description SCL Clock Frequency Hold Time (repeated) START Condition. After this period, the first clock pulse is generated. LOW Period of the SCL Clock HIGH Period of the SCL Clock Set-up Time for a Repeated START Condition Data Hold Time Data Set-up Time
Standard-Mode Min Max 0 100 4.0 -
Fast-Mode Min Max 0 400 0.6 -
Units kHz s s s s s ns s s ns
Notes
TLOWI2C THIGHI2C TSUSTAI2
C
4.7 4.0 4.7 0 250 4.0 4.7 -
- - - - - - - -
1.3 0.6 0.6 0 100[16] 0.6 1.3 0
- - - - - - - 50
THDDATI2
C
TSUDATI2
C
TSUSTOI2 Set-up Time for STOP Condition
C
TBUFI2C TSPI2C
Bus Free Time Between a STOP and START Condition Pulse Width of spikes are suppressed by the input filter.
Figure 9. Definition for Timing for Fast-/Standard-Mode on the I2C Bus
SDA TLOWI2C TSUDATI2C THDSTAI2C
TSPI2C TBUFI2C
SCL S THDSTAI2C THDDATI2C THIGHI2C TSUSTAI2C TSUSTOI2C
Sr
P
S
Note 16. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
Document Number: 001-13108 Rev. *C
Page 30 of 37
[+] Feedback
CY8CLED04
Packaging Information
This section illustrates the package specification for the CY8CLED04 EZ-Color device, along with the thermal impedance for the package and solder reflow peak temperatures. Important Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of the emulation tools' dimensions, refer to the document titled PSoC Emulator Pod Dimensions at http://www.cypress.com/design/MR10161. Figure 10. 68-Pin (8X8X0.90 mm) QFN (Sawn Type)
001-09618 *C
Important Note For information on the preferred dimensions for mounting QFN packages, see the following Application Note at http://www.amkor.com/products/notes_papers/MLFAppNote.pdf. Important Note Pinned vias for thermal conduction are not required for the low-power device.
Document Number: 001-13108 Rev. *C
Page 31 of 37
[+] Feedback
CY8CLED04
Thermal Impedance
Package 68 QFN Typical JA [17, 18] 13.05C/W
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability. Package 68 QFN Minimum Peak Temperature[19] 240oC Maximum Peak Temperature 260oC
Notes 17. TJ = TA + POWER x JA 18. To achieve the thermal impedance specified for the QFN package, the center thermal pad should be soldered to the PCB ground plane. 19. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 5oC with Sn-Pb or 245 5oC with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
Document Number: 001-13108 Rev. *C
Page 32 of 37
[+] Feedback
CY8CLED04
Development Tools
Software
This section presents the development tools available for all current PSoC device families including the CY8CLED04 EZ-Color. PSoC DesignerTM At the core of the PSoC development software suite is PSoC Designer, used to generate PSoC firmware applications. PSoC Designer is available free of charge at http://www.cypress.com/psocdesigner and includes a free C compiler. PSoC Programmer Flexible enough to be used on the bench in development, yet suitable for factory programming, PSoC Programmer works either as a standalone programming application or it can operate directly from PSoC Designer. PSoC Programmer software is compatible with both PSoC ICE-Cube In-Circuit Emulator and PSoC MiniProg. PSoC programmer is available free of charge at http://www.cypress.com/psocprogrammer. CY3263-ColorLock Evaluation Kit The CY3263-ColorLock evaluation board demonstrates the ability of the EZ-Color device to use real-time optical feedback to control three primary, high brightness LEDs and create accurate, mixed-color output. The kit includes:

CY3263-ColorLock Evaluation Board Tools CD, which includes: PSoC Programmer .NET Framework 2.0 (for Windows 2000 and Windows XP) PSoC Designer ColorLock Express Pack CY3263-ColorLock EZ-Color Kit CD ColorLock Monitor Application Kit Documents (Quick Start, Kit Guide, Release Note, Application Note, Data Sheets, Schematics, and Layouts) Firmware Retractable USB Cable (A to Mini-B) PSoC MiniProg Programmer Power Supply Adapter

Evaluation Tools
All evaluation tools can be purchased from the Cypress Online Store. CY3261A-RGB EZ-Color RGB Kit The CY3261A-RGB board is a preprogrammed HB LED color mix board with seven pre-set colors using the CY8CLED16 EZ-Color HB LED Controller. The board is accompanied by a CD containing the color selector software application, PSoC Designer, PSoC Programmer, and a suite of documents, schematics, and firmware examples. The color selector software application can be installed on a host PC and is used to control the EZ-Color HB LED controller using the included USB cable. The application enables you to select colors via a CIE 1931 chart or by entering coordinates. The kit includes: Training Board (CY8CLED16) One mini-A to mini-B USB Cable

CY3265-RGB EZ-Color Evaluation Kit The CY3265-RGB evaluation board demonstrates the ability of the EZ-Color device to use real-time temperature feedback to control three primary, high brightness LEDs and create accurate, mixed-color output. There are three variations of the kit available, depending on the LED manufacturer of the LEDs on the board: CY3265C-RGB (Cree LEDs), CY3265N-RGB (Nichia LEDs), or CY3265O-RGB (OSRAM LEDs). The kit includes:

CY3265C-RGB Evaluation Board Tools CD, which includes: PSoC Programmer PSoC Designer .NET Framework 2.0 (Windows XP 32 bit) Kit Documents (Quick Start, Kit Guide, Release Note, Application Note, Data Sheets, Schematics, and Layouts) Firmware Blue PCA Enclosure/Case 12V 1A Power Supply Retractable USB Cable (A to Mini-B) PSoC MiniProg Programmer Quick Start Guide

PSoC Designer CD-ROM Design Files and Application Installation CD-ROM
To program and tune this kit via PSoC Designer you must use a Mini Programmer Unit (CY3217 Kit) and a CY3240-I2CUSB kit.
Document Number: 001-13108 Rev. *C
Page 33 of 37
[+] Feedback
CY8CLED04
CY3210-MiniProg1 The CY3210-MiniProg1 kit allows a user to program PSoC devices via the MiniProg1 programming unit. The MiniProg is a small, compact prototyping programmer that connects to the PC via a provided USB 2.0 cable. The kit includes: MiniProg Programming Unit


Getting Started Guide USB 2.0 Cable
MiniEval Socket Programming and Evaluation Board 28-Pin CY8C29466-24PXI PDIP PSoC Device Sample 28-Pin CY8C27443-24PXI PDIP PSoC Device Sample PSoC Designer Software CD Getting Started Guide USB 2.0 Cable
CY3207ISSP In-System Serial Programmer (ISSP) The CY3207ISSP is a production programmer. It includes protection circuitry and an industrial case that is more robust than the MiniProg in a production-programming environment. Note CY3207ISSP needs special software and is not compatible with PSoC Programmer. The kit includes:

CY3207 Programmer Unit PSoC ISSP Software CD 110 ~ 240V Power Supply, Euro-Plug Adapter USB 2.0 Cable
CY3210-PSoCEval1 The CY3210-PSoCEval1 kit features an evaluation board and the MiniProg1 programming unit. The evaluation board includes an LCD module, potentiometer, LEDs, and plenty of breadboarding space to meet all of your evaluation needs. The kit includes:

Accessories (Emulation and Programming)
Table 30. Emulation and Programming Accessories
Part # Pin Flex-Pod Kit[20] Package Adapter[21]
Evaluation Board with LCD Module MiniProg Programming Unit 28-Pin CY8C29466-24PXI PDIP PSoC Device Sample (2) PSoC Designer Software CD Getting Started Guide USB 2.0 Cable
CY8CLED04-68LTXI 68 QFN
CY3250-LED04 Adapters can be found at http://www.emulati on.com.
Third Party Tools
Several tools have been specially designed by the following third-party vendors to accompany PSoC devices during development and production. Specific details for each of these tools can be found at http://www.cypress.com under Design Support >> Development Kits/Boards.
Device Programmers
All device programmers can be purchased from the Cypress Online Store. CY3216 Modular Programmer The CY3216 Modular Programmer kit features a modular programmer and the MiniProg1 programming unit. The modular programmer includes three programming module cards and supports multiple Cypress products. The kit includes:

Build a PSoC Emulator into Your Board
For details on how to emulate your circuit before going to volume production using an on-chip debug (OCD) non-production PSoC device, see Application Note "Debugging - Build a PSoC Emulator into Your Board - AN2323".
Modular Programmer Base 3 Programming Module Cards MiniProg Programming Unit PSoC Designer Software CD
Notes 20. Flex-Pod kit includes a practice flex-pod and a practice PCB, in addition to two flex-pods. 21. Programming adapter converts non-DIP package to DIP footprint. Specific details and ordering information for each of the adapters can be found at http://www.emulation.com.
Document Number: 001-13108 Rev. *C
Page 34 of 37
[+] Feedback
CY8CLED04
Ordering Information
Key Device Features
The following table lists the CY8CLED04 EZ-Color device key package features and ordering codes. Table 31. Device Key Features and Ordering Information Analog Outputs 2 2 Digital I/O Pins Analog Blocks Analog Inputs Digital Blocks Temperature Range
68-Pin (8X8 mm) Sawn 68-Pin (8X8 mm) Sawn (Tape and Reel)
CY8CLED04-68LTXI CY8CLED04-68LTXIT
16K 16K
1K
-40C to +85C -40C to +85C
4 4
6 6
56 56
48 48
Yes Yes
Ordering Code Definitions
CY 8 C LED xx - xx xxxx Package Type: Thermal Rating: PX = PDIP Pb-Free C = Commercial SX = SOIC Pb-Free I = Industrial PVX = SSOP Pb-Free E = Extended LTX/LKX = QFN Pb-Free AX = TQFP Pb-Free Pin Count Part Number LED Family Code Technology Code: C = CMOS Marketing Code: 8 = Cypress PSoC Company ID: CY = Cypress
Document Number: 001-13108 Rev. *C
Page 35 of 37
XRES Pin
[+] Feedback
Ordering Code
Package
Flash (Bytes)
SRAM (Bytes)
CY8CLED04
Document History Page
Document Title: CY8CLED04 EZ-ColorTM HB LED Controller Document Number: 001-13108 Rev. ** *A *B ECN No. 1148504 2657959 2794355 Orig. of Change SFVTMP3 DPT/PYRS XBM Submission Date See ECN 02/11/2009 10/28/2009 New document. Added package diagram 001-09618 and updated Ordering Information table Added "Contents" on page 3. Updated "Development Tools" on page 7. Corrected FCPU1 and FCPU2 parameters in "AC Chip-Level Specifications" on page 23. Removed pruned/obsolete parts (CY8CLED04-68LFXI). Updated DC GPIO, AC Chip-Level, and AC Programming Specifications as follows: Modified TWRITE specifications. Replaced TRAMP time) specification with SRPOWER_UP (slew rate) specification. Added note to Flash Endurance specification. Added IOH, IOL, DCILO, F32K_U, TPOWERUP, TERASEALL, TPROGRAM_HOT, and TPROGRAM_COLD specifications. Corrected the Pod Kit part numbers. Updated Development Tools. Updated copyright and Sales, Solutions, and Legal Information URLs. Updated 68-Pin QFN (Sawn Type) package diagram. Description of Change
*C
2850593
FRE/DSG/HMT
01/14/2010
Document Number: 001-13108 Rev. *C
Page 36 of 37
[+] Feedback
CY8CLED04
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives, and distributors. To find the office closest to you, visit us at Cypress Locations.
Products
Automotive Clocks & Buffers Interface Lighting & Power Control Memory Optical & Image Sensing PSoC Touch Sensing USB Controllers Wireless/RF cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc cypress.com/go/plc cypress.com/go/memory cypress.com/go/image cypress.com/go/psoc cypress.com/go/touch cypress.com/go/USB cypress.com/go/wireless
PSoC(R) Solutions
psoc.cypress.com/solutions PSoC 1 | PSoC 3 | PSoC 5
(c) Cypress Semiconductor Corporation, 2007-2009, 2010. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress' product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-13108 Rev. *C
Revised January 15, 2010
Page 37 of 37
PSoC DesignerTM and EZ-ColorTM are trademarks and PSoC(R) is a registered trademark of Cypress Semiconductor Corporation. Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors. All products and company names mentioned in this document may be the trademarks of their respective holders.
[+] Feedback


▲Up To Search▲   

 
Price & Availability of CY8CLED04-68LTXI

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X